100g High Transparency Organic Silicon Elastic Potting Compound

High-transparency organic silicone elastic encapsulation adhesive is a packaging material specifically designed for precision electronics, optical devices, and high-end lighting applications. It features excellent light transmission, flexibility, and environmental stability. The following are its core features and typical applications:

Main Features
1. Superior Optical Performance  
   - Light transmittance ≥90% (visible light range, 2mm thickness), approaching the transparency of optical glass, with low haze, ensuring visual clarity of encapsulated components.  
   - No yellowing over time, UV-resistant, suitable for outdoor exposure environments.

2. Elasticity and Protective Properties  
   - Forms a soft elastic material after curing (typical hardness 20–50 Shore A), capable of absorbing mechanical stress and protecting sensitive components (such as LED chips and sensors) from vibration and impact.
   - Low internal stress prevents brittle cracking.

3. Weather Resistance and Chemical Stability
- Wide operating temperature range (-50°C to +200°C), resistant to high and low temperature cycles.
- Waterproof and moisture-resistant (IP68 rating), resistant to ozone, acids, alkalis, and common solvents.

4. Excellent electrical performance  
   - High insulation resistance (>10¹⁵ Ω·cm), low dielectric constant, suitable for high-frequency circuit packaging.

5. Process adaptability  
   - Two-component (A/B), good flowability, can be vacuum degassed.
   - Adjustable curing time (e.g., 24 hours at room temperature or accelerated by heating), strong adhesion to plastics, glass, and metals.

Typical application scenarios
- Optoelectronics field: LED lighting encapsulation, optical lens bonding, display screen waterproof sealing.
- Electronic protection: PCB board potting, automotive electronic modules, and new energy battery pack protection.
- Precision devices: Sensors (e.g., humidity/pressure sensors) and medical device component encapsulation.
- Research and DIY: Transparent model making and experimental apparatus sealing.

Usage Precautions
- Pre-treatment: Clean the bonding surfaces and remove grease and dust.
- Mixing Ratio: Two-component products must be mixed strictly according to the specified ratio (e.g., 10:1) to prevent incomplete curing.
- Curing conditions: Humidity >50% or heating (e.g., 60°C for 1 hour) can accelerate curing; in low-temperature environments, extend curing time.

Environmental and safety considerations
- Complies with RoHS, REACH, and other standards; solvent-free and low VOC. However, ventilation is recommended during use, and avoid contact with uncured material on the skin.